High-frequency substrates and high-speed transmission substrates (5G and optical communication compatible)
Supports a wide range of PTFE and non-PTFE materials. Achieves cost optimization with a hybrid structure with FR-4.
We provide high-frequency and high-speed transmission boards for 5G communication devices, optical transceivers (SFP/SFP+/QSFP28/QSFP-DD), Wi-Fi modules, and more. We handle a wide range of high-frequency compatible materials, from PTFE-based (such as Rogers) to non-PTFE-based (TUC, Shengyi, ISOLA), and cost-reduction designs are possible by using high-frequency materials only in specific layers through a material hybrid structure with FR-4. We support low-loss materials such as Synamic6/6G/6N and TU872 SLK/LK, and we have manufacturing achievements for 100G/400G optical transceiver boards using composite technologies such as R-5775G material, build-up, back drilling, and copper coin embedding. We also accommodate a 9-layer build-up full stack structure (using Megtron6, L/S=75/75μm).
